NTGS4141NT1G【PDF 1/6 页】MOSFET N-CH 30V 3.5A 6-TSOP

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Sheet目录488

[1页]2页 3页 4页 5页

NTGS4141N

Power MOSFET

30 V, 7.0 A, Single N ? Channel, TSOP ? 6

Features

? Low R DS(on)

? Low Gate Charge

? Pb ? Free Package is Available

http://onsemi.com

Applications

? Load Switch

? Notebook PC

? Desktop PC

V (BR)DSS

30 V

R DS(on) TYP

21.5 m W @ 10 V

30 m W @ 4.5 V

I D MAX

7.0 A

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

Rating Symbol

Drain ? to ? Source Voltage V DSS

Value

Unit

N ? Channel

Drain 1 2 5 6

Gate ? to ? Source Voltage

V GS

± 20

Continuous Drain

Current (Note 1)

Steady

State

T A = 25 ° C

T A = 85 ° C

I D

5.0

3.6

Gate 3

t ≤ 10 s

T A = 25 ° C

7.0

Power Dissipation

(Note 1)

Steady

State

T A = 25 ° C

P D

1.0

Source 4

Continuous Drain

Current (Note 2)

Power Dissipation

(Note 2)

Pulsed Drain Current

t ≤ 10 s

Steady T A = 25 ° C

State

T A = 85 ° C

T A = 25 ° C

t p = 10 m s, V GS =10V

I D

P D

I DM

2.0

3.5

2.5

0.5

TSOP ? 6

CASE 318G

STYLE 1

S4 = Device Code

MARKING

DIAGRAM

S4 M G

Pulsed Drain Current t p = 30 m s, V GS =5V

Operating Junction and Storage Temperature

Source Current (Body Diode)

Single Pulse Drain ? to ? Source Avalanche Energy

(V DD = 30 V, I L = 10.4 A, V GS = 10 V,

L = 1.0 mH, R G = 25 W )

Lead Temperature for Soldering Purposes

(1/8 ″ from case for 10 s)

I D

T J ,

T STG

I S

EAS

T L

? 55 to

150

2.0

260

° C

M = Date Code

G = Pb ? Free Package

(Note: Microdot may be in either location)

PIN ASSIGNMENT

Drain Drain Source

6 5 4

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

THERMAL RESISTANCE RATINGS

1 2 3

Drain Drain Gate

Rating

Symbol

Max

Unit

ORDERING INFORMATION

Junction ? to ? Ambient – Steady State (Note 1)

Junction ? to ? Ambient – t ≤ 10 s (Note 1)

R θ JA

125

62.5

° C/W

Device

NTGS4141NT1

Package

TSOP ? 6

Shipping ?

3000/Tape & Reel

NTGS4141NT1G

Junction ? to ? Ambient – Steady State (Note 2) R θ JA 248

1. Surface ? mounted on FR4 board using 1 inch sq pad size

(Cu area = 1.127 in sq [1 oz] including traces).

2. Surface ? mounted on FR4 board using the minimum recommended pad size

(Cu area = 0.0773 in sq).

TSOP ? 6

(Pb ? Free)

?For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

? Semiconductor Components Industries, LLC, 2012

April, 2012 ? Rev. 5

Publication Order Number:

NTGS4141N/D

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